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Revert "RISC-V 3D Chip Design with TSV and Thermal Modeling" #91

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May 11, 2024
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Revert "RISC-V 3D Chip Design with TSV and Thermal Modeling" #91

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7 changes: 0 additions & 7 deletions .gitignore
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Original file line number Diff line number Diff line change
Expand Up @@ -4,10 +4,3 @@ mm/*
*.deb

.vscode
VLSI24/submitted_notebooks/Open3DFlow/tsv.spice
VLSI24/submitted_notebooks/Open3DFlow/*.mk
VLSI24/submitted_notebooks/Open3DFlow/Open3DFlow
VLSI24/submitted_notebooks/Open3DFlow/HotSpot
VLSI24/submitted_notebooks/Open3DFlow/Results*
VLSI24/submitted_notebooks/Open3DFlow/Thermal_sim*

2 changes: 1 addition & 1 deletion VLSI23/accepted_notebooks/3LFCC/3LFCC_v2p0.ipynb
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Expand Up @@ -16606,7 +16606,7 @@
"name": "python",
"nbconvert_exporter": "python",
"pygments_lexer": "ipython3",
"version": "3.10.3"
"version": "3.10.6"
}
},
"nbformat": 4,
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2,103 changes: 0 additions & 2,103 deletions VLSI24/submitted_notebooks/Open3DFlow/Open3DFlow.ipynb
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