forked from key4hep/k4geo
-
Notifications
You must be signed in to change notification settings - Fork 0
Commit
This commit does not belong to any branch on this repository, and may belong to a fork outside of the repository.
rearrange some files to avoid duplication; fix typos
- Loading branch information
1 parent
749d258
commit a339b41
Showing
21 changed files
with
222 additions
and
427 deletions.
There are no files selected for viewing
This file contains bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
This file contains bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
5 changes: 3 additions & 2 deletions
5
ILD/compact/ILD_l5_v11/SServices00.xml → ILD/compact/ILD_common_v02/SServices01.xml
This file contains bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
This file contains bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
Original file line number | Diff line number | Diff line change |
---|---|---|
@@ -1,27 +1,27 @@ | ||
<lccdd> | ||
<!-- Build slices top-down from innermost slice (closest to IP) to outer-most (away from IP)--> | ||
<module_component thickness="0.100*mm" material="Kapton" info="Power bus: Insulating layer" sensitive="false"/> | ||
<module_component thickness="0.200*mm" material="Al" info="Power bus: Conductor" sensitive="false"/> | ||
<module_component thickness="0.200*mm" material="Aluminium" info="Power bus: Conductor" sensitive="false"/> | ||
<module_component thickness="0.100*mm" material="Kapton" info="Power bus: Insulating layer" sensitive="false"/> | ||
|
||
<module_component thickness="0.100*mm" material="epoxy" info="Glue: Eccobond" sensitive="false"/> | ||
<module_component thickness="0.100*mm" material="Epoxy" info="Glue: Eccobond" sensitive="false"/> | ||
|
||
<module_component thickness="0.050*mm" material="Kapton" info="Module: FPC insulating layer" sensitive="false"/> | ||
<module_component thickness="0.050*mm" material="Al" info="Module: FPC metal layer" sensitive="false"/> | ||
<module_component thickness="0.050*mm" material="Aluminium" info="Module: FPC metal layer" sensitive="false"/> | ||
<module_component thickness="0.050*mm" material="Kapton" info="Module: FPC insulating layer" sensitive="false"/> | ||
<module_component thickness="0.100*mm" material="Silicon" info="Module: r/o ASIC" sensitive="false" /> | ||
<module_component thickness="0.100*mm" material="Silicon" info="Module: Sensor" sensitive="true"/> | ||
|
||
<module_component thickness="0.100*mm" material="epoxy" info="Glue: Eccobond" sensitive="false"/> | ||
<module_component thickness="0.100*mm" material="Epoxy" info="Glue: Eccobond" sensitive="false"/> | ||
|
||
<module_component thickness="0.150*mm" material="CarbonFiber" info="Structure and cooling: CF Skins" sensitive="false"/> | ||
<module_component thickness="0.025*mm" material="CarbonFiber" info="Structure and cooling: Interface" sensitive="false"/> | ||
<module_component thickness="0.100*mm" material="epoxy" info="Structure and cooling: Glue layer" sensitive="false"/> | ||
<module_component thickness="0.100*mm" material="Epoxy" info="Structure and cooling: Glue layer" sensitive="false"/> | ||
<module_component thickness="0.235*mm" material="Water" info="Structure and cooling: Cooling fluid" sensitive="false"/> | ||
<module_component thickness="0.068*mm" material="Kapton" info="Structure and cooling: Cooling Pipe" sensitive="false"/> | ||
<module_component thickness="0.700*mm" material="Allcomp_K9" info="Structure and cooling: Carbon Foam" sensitive="false"/> | ||
<module_component thickness="2.800*mm" material="Rohacell_IG51" info="Structure and cooling: Core" sensitive="false"/> | ||
<module_component thickness="0.100*mm" material="epoxy" info="Structure and cooling: Glue layer" sensitive="false"/> | ||
<module_component thickness="0.100*mm" material="Epoxy" info="Structure and cooling: Glue layer" sensitive="false"/> | ||
<module_component thickness="0.025*mm" material="CarbonFiber" info="Structure and cooling: Interface" sensitive="false"/> | ||
<module_component thickness="0.150*mm" material="CarbonFiber" info="Structure and cooling: CF Skins" sensitive="false"/> | ||
</lccdd> | ||
</lccdd> |
This file contains bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
This file contains bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
This file contains bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
This file was deleted.
Oops, something went wrong.
This file contains bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
This file was deleted.
Oops, something went wrong.
Oops, something went wrong.