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rearrange some files to avoid duplication; fix typos
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danieljeans committed Sep 20, 2023
1 parent 749d258 commit a339b41
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Showing 21 changed files with 222 additions and 427 deletions.
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Expand Up @@ -22,4 +22,4 @@
<module_component thickness="0.068*mm" material="Kapton" info="Cold Plate: Cooling pipe" sensitive="false"/>
<module_component thickness="0.030*mm" material="CarbonFiber" info="Cold Plate: Graphite foil" sensitive="false"/>
<module_component thickness="0.020*mm" material="CarbonFiber_25D" info="Cold Plate: Carbon fleece" sensitive="false"/>
</lccdd>
</lccdd>
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Expand Up @@ -22,4 +22,4 @@
<module_component thickness="0.100*mm" material="Kapton" info="Power bus: Insulating layer" sensitive="false"/>
<module_component thickness="0.200*mm" material="Aluminium" info="Power bus: Conductor" sensitive="false"/>
<module_component thickness="0.100*mm" material="Kapton" info="Power bus: Insulating layer" sensitive="false"/>
</lccdd>
</lccdd>
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@@ -1,13 +1,14 @@
<!--
SService00 parameters for ILD_*_v2
SService01 parameters for ILD_*_v10, v11
(some elements of services are turned off)
-->
<lccdd>
<detectors>

<detector name="SServices00" type="SServices00" id="ILDDetID_NOTUSED" vis="RedVis" insideTrackingVolume="false" sensitive="no" build_tpc_cooling="false" build_ecal_services="true" build_hcal_services="true" build_sit_cables="false" build_vxd_cables="false">
<type_flags type=" DetType_SUPPORT " />

<TPC_Cooling number_of_rings="0"/> <!-- Daniel's understanding (via Dimitra) -->
<TPC_Cooling number_of_rings="0"/>

</detector>
</detectors>
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14 changes: 7 additions & 7 deletions ILD/compact/ILD_common_v02/TrackerDiskModuleIn.xml
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@@ -1,27 +1,27 @@
<lccdd>
<!-- Build slices top-down from innermost slice (closest to IP) to outer-most (away from IP)-->
<module_component thickness="0.100*mm" material="Kapton" info="Power bus: Insulating layer" sensitive="false"/>
<module_component thickness="0.200*mm" material="Al" info="Power bus: Conductor" sensitive="false"/>
<module_component thickness="0.200*mm" material="Aluminium" info="Power bus: Conductor" sensitive="false"/>
<module_component thickness="0.100*mm" material="Kapton" info="Power bus: Insulating layer" sensitive="false"/>

<module_component thickness="0.100*mm" material="epoxy" info="Glue: Eccobond" sensitive="false"/>
<module_component thickness="0.100*mm" material="Epoxy" info="Glue: Eccobond" sensitive="false"/>

<module_component thickness="0.050*mm" material="Kapton" info="Module: FPC insulating layer" sensitive="false"/>
<module_component thickness="0.050*mm" material="Al" info="Module: FPC metal layer" sensitive="false"/>
<module_component thickness="0.050*mm" material="Aluminium" info="Module: FPC metal layer" sensitive="false"/>
<module_component thickness="0.050*mm" material="Kapton" info="Module: FPC insulating layer" sensitive="false"/>
<module_component thickness="0.100*mm" material="Silicon" info="Module: r/o ASIC" sensitive="false" />
<module_component thickness="0.100*mm" material="Silicon" info="Module: Sensor" sensitive="true"/>

<module_component thickness="0.100*mm" material="epoxy" info="Glue: Eccobond" sensitive="false"/>
<module_component thickness="0.100*mm" material="Epoxy" info="Glue: Eccobond" sensitive="false"/>

<module_component thickness="0.150*mm" material="CarbonFiber" info="Structure and cooling: CF Skins" sensitive="false"/>
<module_component thickness="0.025*mm" material="CarbonFiber" info="Structure and cooling: Interface" sensitive="false"/>
<module_component thickness="0.100*mm" material="epoxy" info="Structure and cooling: Glue layer" sensitive="false"/>
<module_component thickness="0.100*mm" material="Epoxy" info="Structure and cooling: Glue layer" sensitive="false"/>
<module_component thickness="0.235*mm" material="Water" info="Structure and cooling: Cooling fluid" sensitive="false"/>
<module_component thickness="0.068*mm" material="Kapton" info="Structure and cooling: Cooling Pipe" sensitive="false"/>
<module_component thickness="0.700*mm" material="Allcomp_K9" info="Structure and cooling: Carbon Foam" sensitive="false"/>
<module_component thickness="2.800*mm" material="Rohacell_IG51" info="Structure and cooling: Core" sensitive="false"/>
<module_component thickness="0.100*mm" material="epoxy" info="Structure and cooling: Glue layer" sensitive="false"/>
<module_component thickness="0.100*mm" material="Epoxy" info="Structure and cooling: Glue layer" sensitive="false"/>
<module_component thickness="0.025*mm" material="CarbonFiber" info="Structure and cooling: Interface" sensitive="false"/>
<module_component thickness="0.150*mm" material="CarbonFiber" info="Structure and cooling: CF Skins" sensitive="false"/>
</lccdd>
</lccdd>
14 changes: 7 additions & 7 deletions ILD/compact/ILD_common_v02/TrackerDiskModuleOut.xml
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Expand Up @@ -2,26 +2,26 @@
<!-- Build slices top-down from innermost slice (closest to IP) to outer-most (away from IP)-->
<module_component thickness="0.150*mm" material="CarbonFiber" info="Structure and cooling: CF Skins" sensitive="false"/>
<module_component thickness="0.025*mm" material="CarbonFiber" info="Structure and cooling: Interface" sensitive="false"/>
<module_component thickness="0.100*mm" material="epoxy" info="Structure and cooling: Glue layer" sensitive="false"/>
<module_component thickness="0.100*mm" material="Epoxy" info="Structure and cooling: Glue layer" sensitive="false"/>
<module_component thickness="2.800*mm" material="Rohacell_IG51" info="Structure and cooling: Core" sensitive="false"/>
<module_component thickness="0.700*mm" material="Allcomp_K9" info="Structure and cooling: Carbon Foam" sensitive="false"/>
<module_component thickness="0.068*mm" material="Kapton" info="Structure and cooling: Cooling Pipe" sensitive="false"/>
<module_component thickness="0.235*mm" material="Water" info="Structure and cooling: Cooling fluid" sensitive="false"/>
<module_component thickness="0.100*mm" material="epoxy" info="Structure and cooling: Glue layer" sensitive="false"/>
<module_component thickness="0.100*mm" material="Epoxy" info="Structure and cooling: Glue layer" sensitive="false"/>
<module_component thickness="0.025*mm" material="CarbonFiber" info="Structure and cooling: Interface" sensitive="false"/>
<module_component thickness="0.150*mm" material="CarbonFiber" info="Structure and cooling: CF Skins" sensitive="false"/>

<module_component thickness="0.100*mm" material="epoxy" info="Glue: Eccobond" sensitive="false"/>
<module_component thickness="0.100*mm" material="Epoxy" info="Glue: Eccobond" sensitive="false"/>

<module_component thickness="0.100*mm" material="Silicon" info="Module: Sensor" sensitive="true"/>
<module_component thickness="0.100*mm" material="Silicon" info="Module: r/o ASIC" sensitive="false" />
<module_component thickness="0.050*mm" material="Kapton" info="Module: FPC insulating layer" sensitive="false"/>
<module_component thickness="0.050*mm" material="Al" info="Module: FPC metal layer" sensitive="false"/>
<module_component thickness="0.050*mm" material="Aluminium" info="Module: FPC metal layer" sensitive="false"/>
<module_component thickness="0.050*mm" material="Kapton" info="Module: FPC insulating layer" sensitive="false"/>

<module_component thickness="0.100*mm" material="epoxy" info="Glue: Eccobond" sensitive="false"/>
<module_component thickness="0.100*mm" material="Epoxy" info="Glue: Eccobond" sensitive="false"/>

<module_component thickness="0.100*mm" material="Kapton" info="Power bus: Insulating layer" sensitive="false"/>
<module_component thickness="0.200*mm" material="Al" info="Power bus: Conductor" sensitive="false"/>
<module_component thickness="0.200*mm" material="Aluminium" info="Power bus: Conductor" sensitive="false"/>
<module_component thickness="0.100*mm" material="Kapton" info="Power bus: Insulating layer" sensitive="false"/>
</lccdd>
</lccdd>
8 changes: 7 additions & 1 deletion ILD/compact/ILD_common_v02/elements.xml
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Expand Up @@ -26,6 +26,12 @@
<D type="density" unit="g/cm3" value="2.699" />
<composite n="1" ref="Al" />
</material>
<material formula="Al" name="Aluminium" state="solid" >
<RL type="X0" unit="cm" value="8.89632" />
<NIL type="lambda" unit="cm" value="38.8766" />
<D type="density" unit="g/cm3" value="2.699" />
<composite n="1" ref="Al" />
</material>
<element Z="95" formula="Am" name="Am" >
<atom type="A" unit="g/mol" value="243.061" />
</element>
Expand Down Expand Up @@ -881,4 +887,4 @@
<D type="density" unit="g/cm3" value="6.506" />
<composite n="1" ref="Zr" />
</material>
</materials>
</materials>
34 changes: 34 additions & 0 deletions ILD/compact/ILD_common_v02/materials.xml
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Expand Up @@ -571,5 +571,39 @@
</material>


<material name="SolenoidMixture">
<D value="4.38" unit="g/cm3"/>
<fraction n="0.666" ref="Al"/>
<fraction n="0.166" ref="Cu"/>
<fraction n="0.084" ref="Ti"/>
<fraction n="0.084" ref="Nb"/>
</material>

<material name="Epoxy">
<D type="density" value="1.3" unit="g/cm3"/>
<composite n="44" ref="H"/>
<composite n="15" ref="C"/>
<composite n="7" ref="O"/>
</material>

<material name="CarbonFiber_25D">
<D type="density" value="0.375" unit="g/cm3"/>
<fraction n="0.60" ref="C"/>
<fraction n="0.40" ref="Epoxy"/>
</material>

<material name="AlBeMet162">
<D value="2.1" unit="g/cm3"/>
<fraction n="0.38" ref="Al"/>
<fraction n="0.62" ref="Be"/>
</material>

<material name="LiquidNDecane">
<D value="0.73" unit="g/cm3"/>
<composite n="10" ref="C" />
<composite n="22" ref="H" />
</material>



</materials>
30 changes: 0 additions & 30 deletions ILD/compact/ILD_l5_v10/FCCmats.xml

This file was deleted.

3 changes: 1 addition & 2 deletions ILD/compact/ILD_l5_v10/ILD_l5_v10.xml
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Expand Up @@ -12,7 +12,6 @@
<includes>
<gdmlFile ref="../ILD_common_v02/elements.xml"/>
<gdmlFile ref="../ILD_common_v02/materials.xml"/>
<gdmlFile ref="FCCmats.xml"/>
</includes>

<define>
Expand Down Expand Up @@ -87,7 +86,7 @@
<include ref="../ILD_common_v02/Yoke05_Barrel.xml"/>
<include ref="../ILD_common_v02/Yoke06_Endcaps.xml"/>
<include ref="../ILD_common_v02/coil03.xml"/>
<include ref="SServices00.xml"/>
<include ref="../ILD_common_v02/SServices01.xml"/>

<plugins>
<plugin name="DD4hepVolumeManager"/>
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25 changes: 0 additions & 25 deletions ILD/compact/ILD_l5_v10/InnerTrackerBarrelModuleDown.xml

This file was deleted.

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