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# PCB | ||
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Board size: 30.0x15.0 mm (1.18x0.59 inches) | ||
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- This is the size of the rectangle that contains the board | ||
- Thickness: 1.6 mm (63 mils) | ||
- Material: FR4 | ||
- Finish: None | ||
- Layers: 2 | ||
- Copper thickness: 35 µm | ||
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Solder mask: TOP / BOTTOM | ||
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- Color: Green | ||
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Silk screen: TOP / BOTTOM | ||
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- Color: White | ||
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Stackup: | ||
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| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent | | ||
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------| | ||
| F.SilkS | Top Silk Screen | | | | | | | ||
| F.Paste | Top Solder Paste | | | | | | | ||
| F.Mask | Top Solder Mask | Green | 10 | | | | | ||
| F.Cu | copper | | 35 | | | | | ||
| dielectric 1 | core | | 1510 | FR4 | 4.5 | 0.020 | | ||
| B.Cu | copper | | 35 | | | | | ||
| B.Mask | Bottom Solder Mask | Green | 10 | | | | | ||
| B.Paste | Bottom Solder Paste | | | | | | | ||
| B.SilkS | Bottom Silk Screen | | | | | | | ||
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# Important sizes | ||
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Clearance: 0.2 mm (8 mils) | ||
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Track width: 0.2 mm (8 mils) | ||
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- By design rules: 0.2 mm (8 mils) | ||
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Drill: 0.5 mm (20 mils) | ||
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- Vias: 0.5 mm (20 mils) [Design: 0.4 mm (16 mils)] | ||
- Pads: 0.7 mm (28 mils) | ||
- The above values are real drill sizes, they add 0.1 mm (4 mils) to plated holes (PTH) | ||
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Via: 0.8/0.4 mm (31/16 mils) | ||
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- By design rules: 0.8/0.3 mm (31/12 mils) | ||
- Micro via: yes [0.2/0.1 mm (8/4 mils)] | ||
- Buried/blind via: yes | ||
- Total: 69 (thru: 69 buried/blind: 0 micro: 0) | ||
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Outer Annular Ring: 0.15 mm (6 mils) | ||
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- By design rules: N/A mm (N/A mils) | ||
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Eurocircuits class: 4B | ||
- Using min drill 0.5 mm for an OAR of 0.15 mm | ||
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# General stats | ||
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Components count: (SMD/THT) | ||
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- Top: 0/4 (THT) | ||
- Bottom: 31/1 (SMD + THT) | ||
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Defined tracks: | ||
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- 0.2 mm (8 mils) | ||
- 0.3 mm (12 mils) | ||
- 0.4 mm (16 mils) | ||
- 0.5 mm (20 mils) | ||
- 0.6 mm (24 mils) | ||
- 0.7 mm (28 mils) | ||
- 0.8 mm (31 mils) | ||
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Used tracks: | ||
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- 0.2 mm (8 mils) (36) defined: yes | ||
- 0.3 mm (12 mils) (176) defined: yes | ||
- 0.4 mm (16 mils) (15) defined: yes | ||
- 0.5 mm (20 mils) (2) defined: yes | ||
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Defined vias: | ||
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Used vias: | ||
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- 0.8/0.4 mm (31/16 mils) (Count: 69, Aspect: 2.0 A) defined: no | ||
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Holes (excluding vias): | ||
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- 0.7 mm (28 mils) (3) | ||
- 3.0 mm (118 mils) (4) | ||
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Oval holes: | ||
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Drill tools (including vias and computing adjusts and rounding): | ||
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- 0.5 mm (20 mils) (69) | ||
- 0.7 mm (28 mils) (3) | ||
- 3.0 mm (118 mils) (4) | ||
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Solder paste stats: | ||
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Using a paste with 87.75 % alloy, that has an specific gravity for the alloy of 7.4 g/cm³ | ||
and 1.0 g/cm³ for the flux. This paste has an specific gravity of 4.15 g/cm³. | ||
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The stencil thickness is 0.12 mm. | ||
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| Side | Pads with paste | Area [mm²] | Paste [g] | | ||
|--------|-----------------|------------|-----------| | ||
| Total | 124 | 62.50 | 0.31 | | ||
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Note: this is just an approximation to the theoretical value. Margins of the solder mask and waste aren't computed. | ||
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