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dram-specs
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dram-specs
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Module Manufacturer SK Hynix (former Hyundai Electronics)
DRAM Manufacturer SK Hynix (former Hyundai Electronics)
Manufacturing Location Code 0x01
Manufacturing Date 2014-W11
Assembly Serial Number 0x0053CDAA
Part Number HMT451U6AFR8C-PB
Revision Code 0x4E30
Maximum module speed 1600 MT/s (PC3-12800)
Size 4096 MB
Banks x Rows x Columns x Bits 8 x 16 x 10 x 64
Ranks 1
SDRAM Device Width 8 bits
Primary Bus Width 64 bits
tCL-tRCD-tRP-tRAS 11-11-11-28
Supported CAS Latencies (tCL) 11T, 10T, 9T, 8T, 7T, 6T
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Module Manufacturer Micron Technology
DRAM Manufacturer Micron Technology
Manufacturing Location Code 0x0F
Manufacturing Date 2012-W20
Assembly Serial Number 0xE363840A
Part Number 16JTF51264AZ-1G6M1
Revision Code 0x4D31
Maximum module speed 1600 MT/s (PC3-12800)
Size 4096 MB
Banks x Rows x Columns x Bits 8 x 15 x 10 x 64
Ranks 2
SDRAM Device Width 8 bits
Primary Bus Width 64 bits
tCL-tRCD-tRP-tRAS 11-11-11-28
Supported CAS Latencies (tCL) 11T, 10T, 9T, 8T, 7T, 6T, 5T
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Module Manufacturer Samsung
DRAM Manufacturer Samsung
Manufacturing Location Code 0x02
Manufacturing Date 2011-W17
Assembly Serial Number 0x85784755
Part Number M378B5773DH0-CH9
Maximum module speed
1333 MT/s (PC3-10600)
Size 2048 MB
Banks x Rows x Columns x Bits 8 x 15 x 10 x 64
Ranks 1
SDRAM Device Width 8 bits
Primary Bus Width 64 bits
tCL-tRCD-tRP-tRAS 9-9-9-24
Supported CAS Latencies (tCL) 9T, 8T, 7T, 6T