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WiiU-SD-Interposer.kicad_pcb
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WiiU-SD-Interposer.kicad_pcb
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(kicad_pcb (version 20221018) (generator pcbnew)
(general
(thickness 1.6)
)
(paper "A4")
(layers
(0 "F.Cu" signal)
(31 "B.Cu" signal)
(32 "B.Adhes" user "B.Adhesive")
(33 "F.Adhes" user "F.Adhesive")
(34 "B.Paste" user)
(35 "F.Paste" user)
(36 "B.SilkS" user "B.Silkscreen")
(37 "F.SilkS" user "F.Silkscreen")
(38 "B.Mask" user)
(39 "F.Mask" user)
(40 "Dwgs.User" user "User.Drawings")
(41 "Cmts.User" user "User.Comments")
(42 "Eco1.User" user "User.Eco1")
(43 "Eco2.User" user "User.Eco2")
(44 "Edge.Cuts" user)
(45 "Margin" user)
(46 "B.CrtYd" user "B.Courtyard")
(47 "F.CrtYd" user "F.Courtyard")
(48 "B.Fab" user)
(49 "F.Fab" user)
(50 "User.1" user)
(51 "User.2" user)
(52 "User.3" user)
(53 "User.4" user)
(54 "User.5" user)
(55 "User.6" user)
(56 "User.7" user)
(57 "User.8" user)
(58 "User.9" user)
)
(setup
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(grid_origin 139.8 98.6)
(pcbplotparams
(layerselection 0x00010fc_ffffffff)
(plot_on_all_layers_selection 0x0000000_00000000)
(disableapertmacros false)
(usegerberextensions false)
(usegerberattributes true)
(usegerberadvancedattributes true)
(creategerberjobfile true)
(dashed_line_dash_ratio 12.000000)
(dashed_line_gap_ratio 3.000000)
(svgprecision 4)
(plotframeref false)
(viasonmask false)
(mode 1)
(useauxorigin false)
(hpglpennumber 1)
(hpglpenspeed 20)
(hpglpendiameter 15.000000)
(dxfpolygonmode true)
(dxfimperialunits true)
(dxfusepcbnewfont true)
(psnegative false)
(psa4output false)
(plotreference true)
(plotvalue true)
(plotinvisibletext false)
(sketchpadsonfab false)
(subtractmaskfromsilk false)
(outputformat 1)
(mirror false)
(drillshape 1)
(scaleselection 1)
(outputdirectory "")
)
)
(net 0 "")
(net 1 "Net-(J1-VDD)")
(net 2 "GND")
(net 3 "Net-(J1-CMD)")
(net 4 "Net-(J1-DAT0)")
(net 5 "Net-(J1-DAT1)")
(net 6 "Net-(J1-DAT2)")
(net 7 "Net-(J1-DAT3{slash}CD)")
(net 8 "Net-(JP1-A)")
(net 9 "Net-(J1-CLK)")
(footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
(tstamp 03d570c8-02e6-428d-882a-a5ae5ef60fb7)
(at 140.7 100.85)
(descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
(tags "capacitor handsolder")
(property "Sheetfile" "WiiU-SD-Interposer.kicad_sch")
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(property "ki_description" "Unpolarized capacitor, small symbol")
(property "ki_keywords" "capacitor cap")
(path "/33b67913-5701-4d69-a4f7-e898c28c972a")
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(pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2127659574)
(net 1 "Net-(J1-VDD)") (pintype "passive") (tstamp 6c1f8e21-f79f-4d3b-899e-b6f184efac95))
(pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2127659574)
(net 2 "GND") (pintype "passive") (tstamp c237a96e-229e-4252-9dbe-45018e00fa95))
(model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
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(footprint "TestPoint:TestPoint_Pad_D2.0mm" (layer "F.Cu")
(tstamp 15e604a5-63e4-4116-8c11-1f4acd88738f)
(at 138.6 104.2)
(descr "SMD pad as test Point, diameter 2.0mm")
(tags "test point SMD pad")
(property "Sheetfile" "WiiU-SD-Interposer.kicad_sch")
(property "Sheetname" "")
(property "ki_description" "test point")
(property "ki_keywords" "test point tp")
(path "/a95fcc33-30c0-4947-8c74-b5c6c91a6b67")
(attr exclude_from_pos_files)
(fp_text reference "ECLK1" (at 0 -1.998) (layer "F.SilkS") hide
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 5883b7ce-b68b-4d32-8a4f-d5e3c07b68e3)
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(fp_text value "ECLK" (at 0.6 -1.9) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 0ed42923-7312-4656-a63f-a19c5594f1ce)
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(fp_text user "${REFERENCE}" (at 0 -2) (layer "F.Fab") hide
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 2a06b1ff-57d3-46b6-9194-68f2403963ae)
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(fp_circle (center 0 0) (end 0 1.2)
(stroke (width 0.12) (type solid)) (fill none) (layer "F.SilkS") (tstamp a93dda51-f3ae-4713-b5db-f4e2b4dfa525))
(fp_circle (center 0 0) (end 1.5 0)
(stroke (width 0.05) (type solid)) (fill none) (layer "F.CrtYd") (tstamp 5cf942dc-3228-435d-85c1-b983df0d8e2f))
(pad "1" smd circle (at 0 0) (size 2 2) (layers "F.Cu" "F.Mask")
(net 8 "Net-(JP1-A)") (pinfunction "1") (pintype "passive") (tstamp 50d1e1fb-cfaf-463e-9e98-d9486df0976f))
)
(footprint "Connector_Wire:SolderWire-2.5sqmm_1x01_D2.4mm_OD3.6mm" (layer "F.Cu")
(tstamp 1e978b1e-c7c4-4b19-86fd-9219202346b0)
(at 142.2 88.4)
(descr "Soldered wire connection, for a single 2.5 mm² wire, basic insulation, conductor diameter 2.4mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator")
(tags "connector wire 2.5sqmm")
(property "Sheetfile" "WiiU-SD-Interposer.kicad_sch")
(property "Sheetname" "")
(property "ki_description" "Generic connector, single row, 01x01, script generated (kicad-library-utils/schlib/autogen/connector/)")
(property "ki_keywords" "connector")
(path "/d0cc58b3-01aa-4bb2-b719-5ca4ddbf2902")
(attr exclude_from_pos_files)
(fp_text reference "J3" (at 0 -3.2) (layer "F.SilkS") hide
(effects (font (size 1 1) (thickness 0.15)))
(tstamp f09322fb-eca0-421d-aba9-f2d696a8aaae)
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(fp_text value "GND" (at -0.2 -3.2) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp e667c4f2-4f0c-40cc-9fd0-e0d2d5940a20)
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(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 0.9 0.9) (thickness 0.14)))
(tstamp 20e6df62-5aa0-447a-93a2-000342ccf337)
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(fp_line (start -2.55 -2.5) (end -2.55 2.5)
(stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp 63ca1532-a412-459f-879b-88a197dede6d))
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(fp_circle (center 0 0) (end 1.8 0)
(stroke (width 0.1) (type solid)) (fill none) (layer "F.Fab") (tstamp 6ceffe6e-8c12-444c-8550-af3ad5fe9dc0))
(pad "1" thru_hole roundrect (at 0 0) (size 4 4) (drill 3) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.0625)
(net 2 "GND") (pinfunction "Pin_1") (pintype "passive") (tstamp a73e47b9-0cc0-4db6-b3b2-d45d01f2ede9))
(model "${KICAD6_3DMODEL_DIR}/Connector_Wire.3dshapes/SolderWire-2.5sqmm_1x01_D2.4mm_OD3.6mm.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(footprint "TestPoint:TestPoint_Pad_D2.0mm" (layer "F.Cu")
(tstamp 3293ea29-b554-4968-af44-4a87c35ee195)
(at 125.8 104.2)
(descr "SMD pad as test Point, diameter 2.0mm")
(tags "test point SMD pad")
(property "Sheetfile" "WiiU-SD-Interposer.kicad_sch")
(property "Sheetname" "")
(property "ki_description" "test point")
(property "ki_keywords" "test point tp")
(path "/a01e5720-03ec-44ee-a4db-45a4692a7170")
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(pad "1" smd circle (at 0 0) (size 2 2) (layers "F.Cu" "F.Mask")
(net 4 "Net-(J1-DAT0)") (pinfunction "1") (pintype "passive") (tstamp 7c1636e3-2201-4d2c-95af-74af25f623e8))
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(descr "SMD pad as test Point, diameter 2.0mm")
(tags "test point SMD pad")
(property "Sheetfile" "WiiU-SD-Interposer.kicad_sch")
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(property "ki_description" "test point")
(property "ki_keywords" "test point tp")
(path "/1639b1c5-15fc-4aea-85b0-d22c23cb4988")
(attr exclude_from_pos_files)
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