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Primarily, if there were a way to separate/detach the heating surface from the primary electronics (not including the temperature sensor), the utility of the reflow plate would increase significantly. I find that after about 5-10 uses the heating panel deteriorates beyond its usefulness. And, since the Dallas 1-wire temperature sensor is not being used, replacement would only require LMT85 replacement provided that the LED and R6,7 could be moved on to the main circuit board.
I did see a comment suggesting substitution of parts such as 2 separate LEDs in place of the one bi-LED component. Makes sense to me, but probably relatively easy to do without changing the PCB layout.
No problem from my perspective using the ATMEGA4809-AFR. Readily available and inexpensive from many vendors such as DigiKey and Mouser in my area (USA). Took a bit of work to figure out the UPDI programming, but a positive experience for me.
Thanks again for designing this. It is really appreciated and has been extremely useful to me.
JG
The text was updated successfully, but these errors were encountered:
I believe the heating panel deteriorates quickly because it actually gets way hotter than what the LMT85 measures. Even when set to 140C I measured over 200C on the heatplate. An easy solution is to use an NTC thermistor stuck under the heatplate instead of the LMT85.
Good idea, but I know that solder melting for reflow does not seem to occur until after 140°C or so for solder that has a 138°C melting point on my system. Maybe we need to factor in the r-values (heat resistance) of any material such as PCBs that are in involved.
Still, I think it would be a good idea if we could detach the heating plate and replace it easily rather than the current design. With constant heating, cooling, and reheating, I can't help but think that there will inevitably be some deterioration of the heating plate.
Thank you kindly for responding to my comment. I think again that this is a great product and just want to make it even better.
Hello and thank you for this amazing project. I have now built 5 of these, all using JLCPCB boards and LSCS components that I have been able to solder on to the boards. I have also made some slight improvements in the firmware code which I have forked and posted at https://github.com/jgoldwein/PCB-reflow-solder-heat-plate/blob/main/Firmware/pcb_reflow_fw/pcb_reflow_fw.ino.
A few suggestions:
Thanks again for designing this. It is really appreciated and has been extremely useful to me.
JG
The text was updated successfully, but these errors were encountered: